Texas Instruments CC2340 is the latest series of microcontrollers added to the company’s connectivity portfolio. The wireless (MCU) enables high-quality Bluetooth Low Energy (LE) at a lower price than any of its existing competitors. The MCU offers flash memory of up to 512KB and 36KB of RAM with over-the-air download support. The device also includes a low standby current and can work for over a decade with a single coin cell. The MCU can be employed in multiple applications such as EV chargers, electronic shelf labels, tire pressure monitoring systems, etc.
According to the company, the product is available in 2 variants, the CC2340R2 and CC2340R5 wireless MCUs, with flash memory of 256KB and 512KB respectively. The company claims the MCUs include an industry-leading standby current of less than 830 nA. The lower standby current helps in achieving better battery backup of up to 10 years on a single coin cell for wireless applications such as electronic shelf labels and tire pressure monitoring systems. The wireless MCUs have a wide operating temperature range of –40ºC to 125ºC to help ensure a stable connection in a wide variety of applications across different consumer and industrial settings.
“Industrywide, 5 billion Bluetooth® enabled devices are forecast to ship in 2022,” said Mark Powell, CEO of the Bluetooth Special Interest Group (SIG), the standards organization that oversees Bluetooth technology. “The commitment and involvement of Bluetooth SIG members like Texas Instruments allow Bluetooth technology to meet the growing demands for enhanced wireless connectivity in a wider range of applications. I am grateful for the contributions of our membership in delivering innovative solutions that benefit the Bluetooth ecosystem and help broaden the adoption of Bluetooth technology.”
The company claims that the MCU series is capable of offering the industry’s best RF performance in any competing Bluetooth LE wireless MCUs, it offers an output power of up to +8 dBm, in addition, the CC2340 devices feature an integrated RF balun to enable a simpler design with fewer external components, leading to cost savings and shorter time for product designing and development.