- The new TRENCHSTOP IGBT7 modules are capable of offering greater power solutions
- Reduces losses in industrial drive applications, which operate at moderate switching frequencies
Enhanced version
When compared to previous generations, the TRENCHTOP IGBT7 chip has higher power density, thus greatly reducing losses. It also offers a high level of controllability for drives applications. All modules equipped with this new chip technology are designed to be backward pin-compatible with the former generation of TRENCHTOP IGBT4 modules. This supports manufacturers in reducing the design cycle for any new inverter platform.
Reduced static losses
Based on the new micro-pattern trench technology, the TRENCHSTOP IGBT7 chips have much lower static losses compared to the IGBT4 chips with the on-state voltage reduced by 20 per cent. This reduces significant losses in the application, especially for industrial drives, which usually operate at moderate switching frequencies. The power modules feature a maximum allowed overload junction temperature of 175 degrees Celsius. Additionally, they have been designed for softer switching.
Availability
The complete 1200 V TRENCHSTOP IGBT7 EasyPIM™ and EasyPACK™ portfolio can be ordered now. Based on the customers’ needs, solder pin and TIM variants complement the offering.