- Silicon Labs release of the BGM220S has increased the range of Bluetooth Low Energy solutions
- Their small-size, low-cost, long battery life and security features enhance their appeal for the growing number of IoT devices
Due to small size, it provides an ultra-compact, low-cost, long battery life, the SiP module adds turnkey Bluetooth connectivity to extremely small products.
High-Performance and security for IoT device makers
These Bluetooth Low Energy SoCs and modules SoCs along with high-performance and security, are ideal for IoT device makers needing ultimate flexibility in their IoT device development, with highly customisable software and RF design options.
Device makers can leverage SiP modules’ small form factor pre-certified Bluetooth Low Energy with little to no RF design or engineering required, while PCB modules can offer many of the benefits of SiP modules at a lower cost.
The company’s silicon and module solutions also support multiprotocol connectivity for the most demanding applications including gateways, hubs and smart lighting. It is infusing its high-performance Bluetooth Low Energy line with the new suite of state-of-the-art security features named Secure Vault.
The company’s new EFR32MG21B multi-protocol wireless SoCs with Secure Vault helps IoT security standardisation and removes security as a barrier to time-to-market. At the same time, the EFR32xG22 Wireless Gecko Series 2 development focuses on advancing the security in IoT.
Other high-performance Bluetooth Low Energy products include EFR32BG21A SoCs and BGM210PA modules with Secure Element. The BGM210PB modules featuring Secure Vault is expected later this year.
Faster and simplified design
Silicon Labs also offers a range of optimized Bluetooth Low Energy solutions featuring low cost, low power and memory efficiency with strong RF performance as well as security features that include Secure Boot with Root of Trust and Secure Loader.
Its Bluetooth Low Energy solutions are ideal for applications including battery-powered end-nodes like wireless sensors, actuators, portable medical and asset tags.
Network Co-Processors for Turnkey Bluetooth Low Energy, Fastest Time-to-Market
Silicon Labs is expanding its NCP portfolio with new Bluetooth Xpress BGX220 pre-certified PCB and SiP modules. The BGX220 UART to Bluetooth Low Energy bridge modules are expected to offer the fastest path to deliver secure, Bluetooth Low Energy connected products to market. Like the BGM220, the Bluetooth Xpress BGX220 simplifies design by giving customers a certified hardware platform that also streamlines code development by implementing the stack up to a simple API that can be used with an external microcontroller.
“Our Bluetooth Low Energy product portfolio showcases Silicon Labs’ unique ability to deliver a complete range of wireless solutions with best-in-class performance, power, size and security features,” said Matt Johnson, senior vice president of IoT at Silicon Labs. “Over the years, Silicon Labs has established a proven track record of success across a wide range of IoT wireless areas including Mesh, Multiprotocol, Proprietary, Thread, Zigbee and Z-Wave, to name a few. We are now focusing our wireless expertise to also establish leadership in the Bluetooth Low Energy space and we have seen excellent market reception for our Secure Bluetooth 5.2 SoCs. The BG22, launched in January, is experiencing among the highest levels of product adoption and opportunity pipeline growth we have ever seen, with a wide range of applications in consumer, medical and smart home products.”
According to Bluetooth SIG’s 2020 Bluetooth Market Update, Bluetooth Low Energy continues to be the fastest-growing Bluetooth radio with a 26 per cent CAGR.
Also launching is the BGM220P, a slightly larger PCB variant optimised for wireless performance along with a better link budget for greater range. BGM220S and BGM220P are among the first Bluetooth modules to support Bluetooth Direction Finding while delivering up to ten-year battery life from a single coin cell.
The EFR32BG22 SoCs and the new BGM220P/S modules (at just 6×6 mm) are currently available.