Sub-6GHz modules support TDD and FDD carrier aggregation (CA), which ensures greater 5G coverage, capacity and throughput
Complying with the 3GPP Release 16 standards, these modules meet industrial needs for enhanced mobile broadband and reliable communication. The modules also speed up the commercialisation of 5G technologies and bring the benefits of mobile broadband to typical scenarios including Fixed Wireless Access, Industrial IoT, Mobile Compute, telemedicine, private networks and more.
New 5G NR sub-6GHz modules include the RG520F (LGA), the RM520F (M.2) based on Snapdragon X65 and the RG520N (LGA), the RM520N (M.2) based on Snapdragon X62. Also offered are second-generation modules that support sub-6GHz and mmWave dual connectivity, the RM530F and RM530N modules (M.2).
The 5G products deliver better link reliability and ultra-low latency, which is expected to accelerate the commercial deployment of 5G applications such as industrial IoT, factory automation and connected vehicles.
The high-end Snapdragon X65 based modules can support fibre-like peak download speeds up to 10Gbps, which can address specific 5G eMBB use cases requiring extremely high data rates, such as 4K/8K ultra high definition (UHD) live steaming.
These modules are now available from Quectel Wireless Solutions.