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A new method for creating 3D integrated circuit connections has now been developed. It works at low temperatures and does not require external pressure. A new technique for the direct three-dimensional bonding of copper electrodes with silver was created by...
Researchers at the Indian Institute of Technology (IIT) Guwahati's Automation, Verification and Security (AVS) Lab have been working on ways to develop secure and reliable integrated circuits (ICs) in order to strengthen India's electronics manufacturing ecosystem with faster and...
It is quipped with efficient power delivery and accurate current delivery systems that allow high-power charge-sharing mode Safe, wireless delivery of high power to charge personal electronics must address a range of challenges including efficiency, reliable communication, Foreign Object Detection...

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