Sunday, April 27, 2025

New Products

Make-In-India Drones For Defence Sector

The four drones offer surveillance, attack, and navigation features, built to boost security and promote local manufacturing. To strengthen India’s defense capabilities and support the...

First “Amplifier-Less” MEMS Tweeter

The micro speaker for wireless earbuds delivers clear sound without an amplifier, uses less power, lowers cost, and fits easily into any design. xMEMS Labs,...

MCU’s  For Low Power And Wide-Temp Applications

Offering low power consumption, broad temperature tolerance, and integrated features for consumer, industrial, and building automation systems.  Renesas Electronics Corporation has announced the release of...

Gate Driver For High-Frequency Power Applications

New gate driver delivers 1.9 A source and 2.3 A sink output, offering robust performance and improved switching efficiency for demanding power systems. Littelfuse, Inc. has introduced...

SoCs Featuring Wi-Fi 6, Multi-Protocol Connectivity

The chip platform brings Wi-Fi 6, Bluetooth 6.0, multi-protocol support, Edge AI, and security to smart homes, healthcare, industry, and automation. InnoPhase IoT has introduced...

1.5MP Global Shutter Sensor For Automotives

Offering superior low-light performance, compact size, and integrated image processing—all in a cost-effective package tailored for next-generation in-vehicle safety systems. OMNIVISION has introduced the OX01N1B,...

World’s Smallest PPG Sensor Head

The world’s smallest PPG sensor head fits in tight spaces, enables health tracking, supports multiple uses, and cuts costs with a compact, low-cost design. SCIVAX...

Compact Wireless SoC With Memory And Power

The series of wireless SoCs delivers performance, memory, and security for Bluetooth LE devices like wearables and medical sensors. Silicon Labs has announced its new...

World’s First 12-Layer HBM4

The first 12-layer HBM4 samples shipped early, offering 2TB/s speed, 36GB capacity, improved heat control, and faster AI memory performance for future use. SK hynix...

Next-Gen Ti Graphics Cards

Rugged durability, SFF-friendly designs, or compact dual-fan options, these new GPUs are engineered for peak performance and seamless customization with intuitive monitoring and overclocking...

Industry’s First High-Power LTE-M/NB-IoT Module

The module breaks the 23dBm limit with up to 30dBm power, boosting LTE-M and NB-IoT range for private networks, smart grids, and industrial IoT. Ubiik...

World’s First UCIe Optical Chiplet

The first optical I/O chiplet with UCIe interface delivers 8 Tbps bandwidth to reduce latency, lower power use, and scale AI with chiplet interoperability. Ayar...

Industry’s Highest Memory Bandwidth FPGA

The FPGA combines HBM with DDR5 and LPDDR5 support, enabling memory bandwidth and efficiency for AI, networking, video processing, and test equipment applications. Altera Corporation...

First Photonic Processor For Real-Time AI Applications

The light-based processor offers 30x energy efficiency and faster performance for AI and simulations—compatible with PCIe, built for real-world computing tasks. Q.ANT has launched its...

SiC MOSFET Six-Pack Modules

Engineered for demanding applications like EV charging, energy storage, motor drives, and renewable platforms, these modules deliver low switching losses, high power density, and...

First 2kA Compact Protection Thyristor 

Ideal for automotive, industrial, renewable energy, and ICT applications, this innovation ensures long-term reliability and protection from damaging overvoltage transients in even the harshest...

Lead-Free Solder Paste For Advanced Assembly

Specifically designed to enhance the "Reverse Hybrid" assembly process for next-gen electronics, offering superior reliability and higher yield rates. SHENMAO America, Inc. unveils its PF606-P...

Power Relays For Military And Aerospace

These relays offer robust vibration, shock, and temperature resistance, along with flexible configuration options to meet the toughest system design requirements. Microchip Technology has announced...
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