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A regularly updated section featuring the latest component releases. Components shown here are sent to us directly by companies as they announce them worldwide. If your company wants to feature components here, please get in touch with us.

Most Integrated BLE Solution To Feature GPU, PMU and VAD In A Single Chip

SmartBond DA1470x from Renesas is a new Bluetooth Low Energy System-on-Chip (SoC). The SoC is currently the only BLE solution in the market to feature a 2D Graphics processor, Voice Activity...

Ultra-thin Capacitors Made From A Century-old Material

Researchers in the fields of materials science and microelectronics are looking for sustainable ways to meet the world's demand for computer power. This can be achieved by developing microelectronics that operate...

Add BLE To More Products Using TI’s CC2340

Texas Instruments CC2340 is the latest series of microcontrollers added to the company's connectivity portfolio. The wireless (MCU) enables high-quality Bluetooth Low Energy (LE) at a lower price than any of...

AMD Targets Embedded and Industrial platforms With R2000 Processors

AMD has announced the release of the 2nd generation of Ryzen Embedded R2000 Processors. The mid-range system-on-chip (SoC) is optimized for a wide range of applications such as ML, IoT, industrial...

Microchip’s Board Will Simplify Embedded System Designing

Microchip has announced the AVR-IoT Cellular Development Board to ease the process of embedded design. The AVR-IoT Cellular Mini Development is based on an 8-bit AVR128DB48 MCU. And is capable of...

Infineon’s CYW20820 BLE SoC Will Adds Flexibility And High-Performance Connectivity To A System

Infineon Technologies has announced AIROC CYW20820 a device specially made for IoT applications. The CYW20820 is a Bluetooth & Bluetooth LE (low energy) system on chip (SoC) which is designed to...

This Bluetooth Location Services Device Last For 10 years On A Coin Cell

Silicon Labs has announced BG22, an energy-efficient Bluetooth location service solution. It incorporates advanced software which is designed to maximize the location-finding capabilities of the BG22 series of SoCs and SiP...

This Conductive Ink Will Simplify Fabrication Of Electronic Components

Electrically conductive polymers, such as polyaniline, hold many fragile components together in medical devices, automobiles, and many other advanced technology. For decades, the synthesis of polyaniline for industrial electronics applications has...

First Cloud Kits To Feature Renesas’ RYZ014A Cat-M1 module

Renesas recently announced two new cloud development kits, CK-RA6M5 and CK-RX65N. The cellular-to-cloud IoT development platform is powered by RA and RX MCU Families of 32-bit microcontrollers (MCUs). The cloud kits...

ROHM’s LDO For Achieving Stable Operation at Nanoscale Capacitance

ROHM has released BD9xxN1 series of LDO regulators that are capable of providing stable operation at nanoscale output capacitance. The capacitors are specifically developed for application in various automotive applications and...
 
 

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