Advanced Bluetooth Low Energy modules combine integrated processing, AES-128 encryption, multiple wireless protocols and versatile interfaces to simplify connectivity in IoT, medical electronics and industrial applications.
TME has expanded its wireless component portfolio with Raytac Bluetooth Low Energy (BLE) modules designed to simplify wireless integration in Internet of Things (IoT) devices, medical electronics and industrial automation systems. Built around Nordic Semiconductor system-on-chips (SoCs), the modules integrate radio functionality, microcontrollers and essential peripheral components, helping electronics designers reduce RF development complexity and accelerate product development.
The modules support Bluetooth versions ranging from BLE 4.0 to BLE 6.2, with data rates of up to 2Mbps. Long Range modes operate at 500kbps and 125kbps, supporting applications that require extended wireless coverage. Selected models based on Nordic nRF54 systems also enable proprietary 2.4GHz transmission at speeds of up to 4Mbps.
Depending on the model, the modules deliver transmit power of 4dBm, 6dBm or 8dBm, with receiver sensitivity reaching -103dBm. Beyond Bluetooth connectivity, the hardware platform supports ANT+, Thread and Zigbee, alongside the IEEE 802.15.4 standard, allowing developers to select wireless technologies suited to different embedded applications.
Processing, security and interface integration
Raytac modules feature Arm Cortex-M4F or Cortex-M33 processor cores, with program memory ranging from 192KB to 1.5MB and RAM of up to 256KB. These resources enable the SoC to manage wireless communication alongside application processing.
Integrated AES-128 encryption, supported by a cryptographic coprocessor, helps protect transmitted data. The modules operate across supply voltages from 1.7V to 5.5V DC and support temperatures ranging from -40°C to +105°C, making them suitable for applications exposed to demanding environmental conditions.
Configurable connectivity includes eight to 48 I/O lines and multiple analogue-to-digital converter (ADC) channels. Supported interfaces include UART, I2C, I2S, SPI, QSPI, PDM, USB and NFC, enabling connections to sensors, memory devices and displays.
Compact designs simplify RF development
Designed for surface mounting on a host device’s PCB, the modules offer chip antennas, PCB-integrated antennas or external antenna connections through dedicated u.FL connectors, depending on the model. Modules within the same series retain a common pin layout, although antenna implementations can differ.
Pre-tested and certified modules can help developers reduce RF testing requirements and simplify radio certification processes. TME has added the Raytac range to its catalogue, with further details available through its website, by clicking here.
