HomeElectronics NewsEnhancing Smart Rings With AIoT Collaboration

Enhancing Smart Rings With AIoT Collaboration

Collaboration in the AIoT and semiconductor sectors is revolutionizing innovative ring technology, boosting efficiency and performance in compact designs.

Smart Rings

Ambiq, a developer of semiconductor technology, has partnered with Bravechip, an artificial intelligence of things (IoT) systems provider in package (SiP) solutions and printed circuit board assembly (PCBA). Together, they have developed the BCL603S3L chiplet, featuring the Apollo3 Blue Systems-on-a-Chip (SoC). This collaboration enhances smart ring designs’ energy efficiency, functionality, performance, and reliability.

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The users of the BCL603S3L chiplet will be manufacturers of smart rings. These companies will integrate the chiplet into their designs to enable a wide range of health monitoring and activity tracking functions, such as heart rate, blood oxygen level, and step counting, in a compact and efficient form factor. Additionally, the smart rings powered by this chiplet will connect to smartphones via Bluetooth, providing users with real-time data and insights from their wearable devices.

The developed chiplet uses the Apollo3 Blue as its main controller. It optimizes the CPU to achieve a power level of 6 uA/MHz, reducing power usage for various functions such as monitoring heart rate, blood oxygen, and blood pressure, tracking sleep and steps, and having 3DoF and 6DoF capabilities.

Equipped with BLE 5.2 and embedded low-power Bluetooth stacks with GATT services, the Apollo3 Blue SoC connects smart rings to smartphones. Its integration supports a smaller 4×6.8mm LGA package design, allowing Smart Ring manufacturers to use a two-layer FPC board. This reduces the Bill of Materials (BOM) by 30%, decreases failure rates, and shortens the product design cycle.

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“Our partnership with Ambiq has helped to enable the BCL603S3L with a meager power and high performing SIP. The support of the Apollo3 Blue provides smart ring manufacturers with improved flexibility, reliability, and power efficiency designed to minimize the development lifecycle,” said Zongming Jin, the CEO of Bravechip. 

“Working with Bravechip helps bring our low-power solution to a specialized segment within digital health devices. Our Apollo3 Blue System-on-a-Chip within Bravechip’s Systems-in-a-Package will help to create even higher performing smart rings capable of meeting consumer needs,” said Terry Pan, VP of Sales, Ambiq China.  

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Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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