With a modular base system, advanced 3D technology, and flexible configurations, it minimizes training, enhances efficiency, and adapts to evolving production needs—all while addressing industry challenges like labor shortages.
GÖPEL electronic introduces the Multi Line product family, an advanced and versatile platform of inspection systems designed to enhance the entire electronics manufacturing process. The solution has a modular base system paired with a standardized, robust software interface. This design minimizes training requirements, facilitates flexible staff deployment, and fosters seamless knowledge sharing among production teams, addressing the challenges posed by a skilled labor shortage.The platform’s modularity ensures that camera modules can be tailored to current needs or retrofitted for future applications, making it a sustainable investment for evolving manufacturing processes.
The Multi Line platform is a true all-rounder, configurable for a wide range of inspection tasks, including solder paste inspection (SPI), automated optical inspection (AOI) for surface mount technology (SMT) and through-hole technology (THT), as well as conformal coat inspection (CCI). For THT PCB assemblies, the system supports flexible transport options—carrier-based or carrier-free—and integrates all necessary camera modules. It also offers THT solder inspection during the return process via an optional lower transport conveyor. Using 3D technology, the system evaluates solder joints for quality, shorts, volume, and pin length without flipping the PCB.
Its adaptability extends to the SMT process, where optional double-sided inspection eliminates the need for flipping the PCB, ensuring comprehensive testing. As an SPI system, Multi Line inspects solder paste deposits for shape, height, volume, and more, offering closed-loop integration with solder paste printers and fault analysis through the PILOT Verify software. The Multi Line CCI system excels in protective coating inspection, using UV LEDs and telecentric optics to deliver high-contrast images. Its dual-sided inspection capability enables simultaneous top and bottom inspection without flipping the PCB, with an optional return conveyor for rework efficiency.
