Friday, December 5, 2025

High Power Components For Modern Electronics

More power in less space. New MOSFETs keep devices running and efficient. See how they work in TVs, monitors, and chargers.

Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source
Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source

Designers of high-end consumer electronics such as gaming monitors, premium TVs, and AI laptop chargers are constantly challenged to deliver higher power in smaller, sleeker devices. These applications demand components that can handle high current, maintain efficiency, and effectively manage heat within compact circuit designs. Conventional power devices often struggle to balance these requirements, leading to energy loss, unstable switching, and design constraints.

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To solve these issues, Magnachip Semiconductor Corporation (NYSE: MX) has introduced two new 650V Super Junction MOSFETs (SJ MOSFETs) featuring a TO-Leadless (TOLL) package. These devices are specifically designed to meet the needs of high-power, high-current systems where efficiency and thermal performance are critical. By adopting advanced packaging and circuit design, the company claims that the MOSFETs help engineers create more reliable and compact power systems for demanding applications.

The new devices feature a 4-pin Kelvin configuration—an upgrade from the company’s earlier 3-pin eXtreme Trench MOSFETs. This design reduces parasitic inductance in the gate-source return path, improving switching stability and cutting down gate ringing, which leads to smoother operation and less energy loss.

Compared to standard D2PAK packages, the 4-pin TOLL package can handle more than twice the current, uses 24% less board space, and is 48% thinner. This combination of smaller size and higher power handling makes it well-suited for next-generation, high-efficiency consumer and industrial power systems.

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Hyuk Woo, CTO of Magnachip, commented: “Our new 650V SJ MOSFET TOLL products are designed to meet both PCB space-saving and high-performance requirements of slim form-factor applications. Magnachip will continue to expand its 600V TOLL package product lineup in the near future to support new-generation products for AI datacenters and high-power applications.”

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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