A chip design software helps engineers check power, heat, timing, and electromagnetic effects together, reducing design time and improving chip development.
Synopsys has introduced its first Multiphysics Fusion solutions for customer deployment, combining its AI-powered electronic design automation (EDA) tools with Ansys signoff analysis. The new portfolio is designed to help engineers address signal integrity, power integrity, thermal effects, electromagnetic interference, and co-packaged optics in advanced chip designs and multi-die systems.
As semiconductor designs become more complex, engineers increasingly need to consider multiple physical effects together rather than treating them separately. The Multiphysics Fusion portfolio brings these analyses into a unified workflow across timing signoff, design closure, multi-die design, and analog design. According to Synopsys, the solutions help improve design predictability, reduce design iterations, and speed up convergence for AI and high-performance computing chips.
The first release includes GPU-accelerated workflows that use NVIDIA CUDA-X libraries, including cuDSS, to improve simulation performance.
The Multiphysics Fusion for Timing Signoff solution combines Synopsys PrimeTime with Ansys RedHawk-SC, RedHawk-SC Electrothermal, Synopsys StarRC, and HFSS-IC. It performs SPICE-accurate timing analysis while considering power, thermal, and mechanical stress effects, delivering up to three times faster runtimes and helping reduce timing errors caused by power integrity issues.
The Multiphysics Fusion for Design Closure solution integrates Synopsys PrimeClosure with RedHawk-SC to include power integrity during design optimization. Synopsys says the workflow can deliver up to ten times faster design closure, improve engineering change order (ECO) success rates, and optimize power, performance, and area (PPA) with fewer design iterations.
For advanced packaging, Multiphysics Fusion for Multi-die Designs combines Synopsys 3DIC Compiler with RedHawk-SC, RedHawk-SC Electrothermal, and HFSS-IC. The integrated workflow enables concurrent analysis of power integrity, thermal behavior, and electromagnetic effects from early design exploration through final signoff.
The Multiphysics Fusion for Analog and Photonic Design integrates Synopsys Custom Compiler with HFSS-IC for electromagnetic analysis during analog IC development. It also combines Synopsys OptoCompiler with Lumerical to support the design of photonic integrated circuits and co-packaged optics systems.
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