A fast-drying cleaning formulation removes no-clean and rosin flux from electronic assemblies without leaving residue or requiring a secondary rinse, supporting electronics manufacturing, rework, and repair.
Electronics manufacturers can simplify post-soldering cleaning with a flux remover that combines fast evaporation, material compatibility, and HFC-free chemistry. The FRC2 General Purpose Flux Remover is designed to remove no-clean and rosin flux from printed circuit boards (PCBs) and electronic components without requiring a secondary rinsing step.
Developed by MicroCare, FRC2 replaces the company’s existing FRC General Purpose Flux Remover with an updated formulation that eliminates hydrofluorocarbons (HFCs). It is intended for electronics assembly, rework, repair, and maintenance operations where flux residues need to be removed efficiently without adding extra cleaning stages.
The cleaner can be used on through-hole assemblies, surface-mount technology (SMT) boards, ball grid array (BGA) boards, hybrid circuits, cables, and connectors. Its fast-drying properties help reduce cleaning time, while its residue-free performance simplifies workflows by eliminating the need for a separate rinse. The formulation is also nonflammable, non-corrosive, and electrostatic discharge (ESD)-safe, making it suitable for use around sensitive electronic assemblies.
The key features are:
- Replaces the earlier FRC General Purpose Flux Remover.
- Available in multiple bulk-liquid package sizes.
- Aerosol format supports controlled application using the TriggerGrip Cleaning Tool.
- Compatible with lint-free cleaning wipes for contamination control.
- Designed for both benchtop and bulk cleaning workflows.
FRC2 is compatible with most plastics and materials such as epoxies, nylon, polyethylene, and polypropylene. It can also be used on most electronic components, including surface-mount components, although compatibility should be confirmed for specific assemblies and materials before production use.
The product is available in aerosol and bulk liquid formats to support different cleaning requirements. The aerosol version suits benchtop cleaning during repair, rework, and maintenance, while the bulk liquid supports cold dip-and-wipe cleaning of larger components and assemblies, as well as production cleaning tasks. The aerosol format is compatible with MicroCare’s TriggerGrip Cleaning Tool, which enables controlled application. Bulk liquid is available in multiple package sizes.
The HFC-free formulation is also described as ozone-safe and has a medium global warming potential (GWP). This gives manufacturers an alternative when evaluating cleaning chemistries in response to environmental considerations and changing regulatory requirements.
Compatible lint-free cleaning wipes are available separately to support contamination control and consistent cleaning in electronics manufacturing and repair environments.
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