Job function: Thermal Software team works on achieving industry leading Thermal/Limit SW management solution on Qualcomm Mobile, IoT, Automotive and AR/VR targets. In this position, the candidate will be working with cross-functional teams to analyze and identify thermal challenges, peak current risks and provide SW solution to mitigate thermal issues.
Skills/experience: Embedded systems background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display, Graphics, etc.), operating systems concepts – Hands on experience in debug tools like JTAG debugger, oscilloscopes, logic analyzers, understanding of mobile power and thermal management SW development.
Responsibilities: Identified candidate will need to perform system level analysis of thermal use cases, expected to collaborate with Architecture, HW design, Performance, Power/Thermal Systems and various software teams to work towards optimal system level thermal SW solution. In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengths and weaknesses, and come up with thermal mitigations schemes that are best in the industry.
Education requirements: M.Tech/B.Tech or equivalent degree in Electronics and Communication with 2+ year of work experience in software development and system analysis using programming language such as C, C++, Java, Python, etc
Bachelors – Computer Science, Bachelors – Engineering, Bachelors – Information Systems
1+ years experience with Programming Language such as C, C++, Java, Python, etc.
1+ years experience working in a large matrixed organization. ,1+ years experience with API. ,1+ years experience with Database Management Software.
Mathematical Methods, Object-Oriented Programming (OOP), Scientific Analysis, Software Development Lifecycle (SDLC), Software Solutions