Tuesday, June 18, 2024

360 Smart Camera Reference Design

The camera reference design integrates sensors and processors, offering image processing, AI capabilities, connectivity, and security for various IoT applications.


Indeed, in today’s rapidly evolving world, the significance of addressing critical needs has never been more apparent. As we navigate an era marked by unprecedented challenges and opportunities, it becomes imperative to underscore the essentiality of identifying and addressing these needs effectively. Whether it pertains to global issues like climate change and healthcare or the daily requirements of individuals and communities, pursuing solutions tailored to meet these needs has become a driving force for innovation and progress.

The Qualcomm 360 smart camera reference design integrates robust multisensors with cutting-edge software and processors, enabling it to facilitate machine learning, capture 360-degree video, and perform heterogeneous computing tasks with exceptional efficiency and performance. Inside the reference design is the Qualcomm Vision Intelligence Platform, representing a solution designed to deliver unparalleled image processing capabilities and advanced Artificial Intelligence (AI) functionalities, all within a cost-effective framework tailored to serve an array of Internet of Things (IoT) devices. These encompass a broad spectrum of applications, including action cameras, VR/360 devices, home and enterprise security systems, and wearable cameras. 

The platform showcases Qualcomm Technologies’ pioneering family of system-on-chips (SoCs), specially crafted for the IoT landscape, employing cutting-edge 10-nanometer processing technology to ensure exceptional power efficiency and thermal performance. The Vision Intelligence 300 platform is founded upon the QCS603 SoC, while the Vision Intelligence 400 platform relies on the QCS605 SoC. These SoCs are thoughtfully designed to accommodate either Linux or Android as the operating system, with each design seamlessly integrating power management ICs, audio codec support, and Wi-Fi/Bluetooth connectivity. This integration empowers our customers to achieve significant cost savings by streamlining their Bill of Materials (BOM) and simplifying the commercialization efforts required to integrate multiple subsystems.

The technology offers a range of features, including a dual 14-bit Qualcomm Spectra 270 Image Signal Processor (ISP) capable of supporting dual 16MP sensors, all fabricated using an advanced 10nm FinFET process for exceptional thermal and power efficiency. It also boasts the Qualcomm Adreno 615 GPU with 64-bit addressing, reaching speeds of up to 780MHz and featuring the latest API support, as well as the Qualcomm Hexagon 685 DSP with dual hexagon vector extensions, ideal for running DNN models and advanced computations. With up to eight Qualcomm Kryo 300 CPU cores optimized for both power efficiency and DMIPS, it delivers outstanding performance. Additionally, this technology supports high-resolution 24-bit audio, incorporating Qualcomm aptX and aptX HD audio codecs, along with the Qualcomm Aqstic audio codec. Its robust hardware-based security features encompass secure boot from a hardware root of trust, a trusted execution environment, hardware crypto engines, storage security, debug security with lifecycle control, key provisioning, and wireless protocol security.

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Qualcomm has tested this reference design. It comes with a Bill of Materials (BOM), schematics, etc. You can find additional data about the reference design on the company’s website. To read more about this reference design, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.


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