HomeEngineering Projects For YouGaN Reference Design Powers Bidirectional Converters

GaN Reference Design Powers Bidirectional Converters

Enables compact, high-efficiency bidirectional power conversion for battery storage, EV charging, and grid-connected industrial systems. 

GaN Reference Design Powers Bidirectional Converters

The rapid adoption of renewable energy systems, battery energy storage, electric vehicle charging infrastructure, and industrial microgrids is driving demand for compact, highly efficient bidirectional power converters. Addressing these requirements, Texas Instruments (TI) has introduced the TIDA-010957 reference design, a high-power Gallium Nitride (GaN)-based platform that provides engineers with a proven architecture for developing three-phase bidirectional AC/DC power conversion systems. Rather than being a finished product, the design serves as a validated hardware template that enables designers to accelerate development while reducing design risks associated with high-frequency power electronics. 

GaN Powers Bidirectional Converters

At the heart of the reference design is a three-level flying capacitor topology configured for a three-phase plus neutral bidirectional converter. Unlike conventional two-level converters, this multilevel architecture reduces the voltage stress experienced by individual switching devices, allowing the design to employ 650V-rated GaN switches in systems operating with DC bus voltages reaching 900V. Lower switching stress translates into lower switching losses, improved reliability, and higher overall conversion efficiency, making the design suitable for demanding industrial applications. 

One of the major engineering advantages is its ability to operate at an equivalent switching frequency of 125kHz. The high-speed switching capability of integrated GaN power devices significantly reduces the size of output filter magnetics, helping designers build more compact and lightweight power converters with increased power density. This makes the design especially valuable where installation space is limited, including energy storage systems, grid-tied inverters, fast EV charging equipment, and industrial power conversion platforms. TI reports that the reference design achieves up to 98.9% efficiency at full load, demonstrating the performance benefits of combining multilevel converter architecture with GaN technology. 

The design also addresses one of the practical challenges encountered in the three-phase power conversion phase, current imbalance. Its control strategy includes mechanisms for managing unequal current distribution across the three phases, enabling stable converter operation under varying load conditions. Control is implemented using TI’s C2000 TMS320F28P550SJ real-time microcontroller, while precision sensing and monitoring are supported by devices including the AMC0381D reinforced isolated amplifier and the ISOTMP35 isolated temperature sensor, providing a complete platform for digital power control and system monitoring. 

For design engineers, the value extends beyond hardware validation. TI supplies complete development resources, including schematics, PCB layouts, Gerber files, bill of materials, assembly drawings, CAD models, and a detailed design guide with verified performance results. These resources allow engineering teams to study thermal performance, PCB layout techniques, control implementation, and power-stage optimization before adapting the design to their own products. The platform has also been validated using grid emulators, DC emulators, oscilloscopes, thermal imaging equipment, and closed-loop control testing, giving developers confidence in its real-world operating characteristics. 

As industrial electrification advances, this reference design gives engineers a ready platform for developing efficient bidirectional power converters. Combining multilevel topology, GaN switching, and digital control, it helps reduce development time while improving efficiency and power density. The tested design by TI includes a BOM, schematics, PCB layout, assembly files, and supporting documentation, with additional resources available on clicking this link.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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