Sunday, June 16, 2024

Compact IGBT Modules For Industry And Transport

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IGBT modules improve efficiency in diverse applications through a versatile housing design and simplified paralleling, providing cost-effective solutions.

IGBT module

The shift towards offloading complexity to suppliers and adopting smaller IGBT modules is evident in various applications. In response to the global push for downsizing and integration, Infineon Technologies AG has launched the 4.5 kV XHP™ 3 IGBT modules for medium voltage drives and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies. Applications include large conveyor belts, pumps, high-speed trains, locomotives, and commercial, construction, and agricultural vehicles.

The new housing for high-power IGBT modules is designed to cover the voltage range of IGBT chips from 3.3 to 6.5 kV. Its scalability simplifies system design and manufacturing. Additionally, its architecture provides reliability in applications with demanding environmental conditions.

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The XHP family comprises a 450 A dual IGBT module with TRENCHSTOP™ IGBT4 and an emitter-controlled diode and a 450 A double diode module with an emitter-controlled E4 Diode. 

Both modules feature an isolation of 10.4 kV. They help to simplify paralleling and downsizing without sacrificing efficiency. Previously, busbars were required to parallelize switching modules, resulting in design efforts and leakage inductance. The design of the XHP family simplifies paralleling by placing the connections side by side. As a result, only a single busbar is required for paralleling. 

The 4.5 kV XHP family also allows developers to reduce the number of units. Conventional IGBT solutions use multiple single switches and a double diode. The new devices can reduce designs to two dual switches and a smaller double diode.

Combining the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 double diode enables cost savings and a smaller footprint. For example, Infineon’s previous IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and one 140 x 130 mm² double diode. The new XHP family can reduce the components to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² double diode.

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.


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