Sunday, July 14, 2024

Presenting New Engineering Adhesive Solutions In Asia

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UV reactive, features excellent elasticity, durable in high-temperature environments along with having high tensile strength

Designed to address modern industry demands and replace traditional gaskets, the new AU588 solution by the adhesive specialist Bostik has been developed to accommodate the automation of manufacturing processes.

The product focuses on ‘by-the-dot’ bonding and gasket applications required in the development of consumer electronics and automotive including advanced driver-assistance systems (ADAS) and engine control unit (ECU).

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As a CIPG product, the AU588 is UV reactive, features high seal performance and excellent elasticity. It also displays long durability in high-temperature environments and excellent hydrolysis resistance, along with having the unique balance of high elongation and high tensile strength, ensuring high strength even when exposed to a high compression ratio.

The new AU588 solution is part of the first wave of instant engineering gasket developments under the Bostik Born2Bond brand, which fits the industrial tendency of high efficiency, automated process, odd-shaped design, smaller size, light-in-weight, less waste and water/dust proofing.

Bostik’s goal is to create smart solutions for Industry 4.0 in Asia. And its products offer excellent elasticity and proper dispensability, along with exceptional product quality, durability and strength.

Available in a range of advanced formulations, Bostik Born2Bond Instant Adhesives overcome many of the performance and application limitations of existing solutions. The products facilitate faster, smarter production processes while prioritising user safety and sustainability.


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