Robust Tacking Agent for Power Module Assembly

By Sharad Bhowmick

Indium InTACK

Indium Corporation has announced the release of its new adhesive solution named InTack. The solution is specially designed as a drop-in, robust tacking agent for power module assembly. It is a no-clean, no residue, a halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.

According to the company, the InTACK is designed for no-flux reflow applications with formic acid. The adhesive is formulated with high tack to hold a die, IC, or other SMD components such that the material is completely evaporated out during the reflow process, which eliminates the need for time-consuming post-process residue cleanups. This low-cost, tooling-free solution helps in maintaining precise assembly alignments and provides strong tacking and a comfortable long working time.

Advantages of InTACK are:

  • Maintains precise assembly alignment
  • Compatible with solder preforms, dies, and power module components
  • Robust tacking and long working time
  • Optimal performance in formic acid/vacuum reflow
  • No residue, no cleaning
  • Dispensing application tested and process proven


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