Wednesday, April 24, 2024

TempSave Soldering Materials To Decreases Energy Wastage During Reflow Process

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Soldering material for temperature-sensitive electronics components. TempSave can improve the strength of your solder and avoid cold solder joints.

Nihon Superior has announced TempSave, a series of low-temperature soldering materials. Soldering materials that melt at lower temperatures offers multiple advantages such as a reduction in energy utilization for melting the solder, moreover, it can reduce defects contributing to package warpage, and also avoid potential damage to temperature-sensitive devices.

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According to the company, the TempSave soldering materials offer improvements in reliability, thermally stable joining, and lead-free die attach. The TempSave series melts at a lower temperature which decreases energy wastage during the reflow process and improves the quality of solder. TempSave B58 and TempSave B37 are part of the TempSave lineup. TempSave B58 has a melting point of 139°C, it is a eutectic SnBi alloy while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.

Unlike most other alloys with high bismuth content which are brittle and therefore offers poor drop shock performance, the TempSave B37 has good drop performance. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. There is a high-speed jetting paste version called TempSave B37 P611 which provides consistent dot sizes.


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