- Collaboration on SiC modules paves the way for enhanced compactness and peak power density.
- This announcement emphasises their shared vision for future advancements.
Nexperia has unveiled a collaboration with the global supplier of electronic components, KYOCERA AVX Components (Salzburg) GmbH. Their joint endeavour focuses on developing a 650 V, 20 A silicon carbide (SiC) rectifier module. This advanced module is optimised for high-frequency power operations ranging between 3 kW to 11 kW power stack designs. Target applications encompass industrial power supplies, EV charging stations, and on-board chargers.
The rising demand for space efficiency and weight reduction in next-generation power applications underscores the significance of this new module. It stands out with its compact footprint, ensuring heightened power density. This characteristic minimises the necessary board space and contributes to a reduction in the overall system expense. The module optimises thermal performance through top-side cooling (TSC) and an integrated negative temperature coefficient (NTC) sensor. This sensor continuously monitors the device’s temperature, furnishing real-time feedback essential for accurate prognosis and diagnosis at the device or system level. Its low inductance package facilitates high-frequency operations, and it’s certified to function with a junction temperature as high as 175 °C.
Combining silicon carbide semiconductors with avant-garde module packaging enhances the company’s ability to cater to the surging demand for power electronic items with superior power density. The combined strengths of both the companies in manufacturing and module expertise offer a powerful solution for those aiming for elevated power densities using wide bandgap semiconductor tech. The company anticipates that samples of these SiC rectifier modules will be accessible to the market by the first quarter of 2024.