The World’s First Wi-Fi 7 Ready Smartphone Platform

By Sharad Bhowmick

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The Wi-Fi 7-ready 5G series SoC from MediaTek enables immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity.

MediaTek Dimensity 9200 flagship chipset

Dimensity 9200 from MediaTek is a 5G chipset that will enable new possibilities to upcoming smartphones. It is the first smartphone chip to integrate an Arm Cortex X3 with operating speeds of over 3GHz. The 5G system on chip (SoC) offers enhanced performance and better power saving than the previous generations of Dimensity chipsets. The 5 G-ready chipset is also suitable for use in high-end smartphones with foldable displays. It offers extreme performance and intelligent power efficiency, moreover, the SoC can provide an ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity.

“MediaTek’s Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit at MediaTek. “With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors.”

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The Dimensity 9200 integrate an Arm Cortex X3 CPU and an Arm Immortalis-G715 GPU with a hardware-based ray tracing engine. For enhanced gaming, the chipset offers a MediaTek’s HyperEngine 6.0 Gaming Technology which enables fast, fluid action, better frame rates and higher resolution. The Dimensity 9200 provides up to 30% power savings with AI-NR and 45% power savings with AI-SR in all visual applications. It is also the first Wi-Fi 7-ready

The Dimensity 9200 is the first Wi-Fi 7-ready smartphone platform, supporting up to 6.5 Gbps data rates. The chipset integrates an advanced, built-in 5G modem with AI for faster network searching, 5G connection recovery out of dead zones, and other intelligent connectivity enhancements. It also delivers seamless 5G experiences by fluidly switching between long-reach sub-6GHz and super-fast mmWave connections simultaneously. Users can connect everywhere thanks to MediaTek’s Bluetooth and Wi-Fi coexistence technology, allowing Wi-Fi, Bluetooth low energy (LE) audio and wireless peripherals like gamepads to connect at the same time without interference. Additionally, the chipset’s dual antenna system intelligently switches between extreme performance and ultra-low power antennas based on real-time user needs.

Key features of the MediaTek Dimensity 9200 include:
• 2nd Generation TSMC 4nm process
• Cutting-edge display technology
• AI visual semantic display
• MediaTek AI-SR/MEMC
• MediaTek Smart Blulight Defender
• Bluetooth LE Audio-ready technology
• LPDDR5X with support for up to 8533Mbps memory
• UFS 4.0 with Multi-Circular Queue (MCQ)


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