HomeSpecialTruly Innovative ElectronicsIntroducing 3D Sonic Sensor For Accurate Fingerprint Scanning Results

Introducing 3D Sonic Sensor For Accurate Fingerprint Scanning Results

Uses advanced ultrasonic wave technology to scan 3D features of a human finger while capturing more biometric data

The 3D Sonic Sensors developed by Qualcomm deliver in-display fingerprint scanning that is fast and reliable while identifying prints even when your fingers are wet.

The sensors use technological advances and acoustics (ultrasonic waves) to scan 3D features such as ridges, valleys as well as pores of a user’s finger for a deeply accurate image, allowing fingerprint scanning through solid surfaces like glass and metal even while wet.

The ultra-thin sensor measures 0.2mm, which enables OEMs to build mobile devices with cutting-edge form factors, including full edge-to-edge flexible OLED displays.

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Qualcomm Technologies’ first generation of Qualcomm 3D Sonic Sensor was featured in many flagship smartphones including the Samsung Galaxy S10, Note10, S2 and Note20 series.

The Gen 1 3D Sonic Sensor measured 4mm x 9mm (surface area 36mm2). Gen 2 will debut with a sensor that is 8mm x 8mm (64mm2), which is 77% larger than Gen 1. The larger size provides a larger region for placing your finger and allows it to capture 1.7x more biometric data. This larger sensor combined with faster processing will be 50% faster than Gen 1 so you can unlock your device quicker than ever.

The Qualcomm 3D Sonic Sensor Gen 2 are expected to debut in mobile devices in early 2021.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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