HomeTechnologySchottky Barrier Rectifier Outperforms Conventional Switching Diodes

Schottky Barrier Rectifier Outperforms Conventional Switching Diodes

Littelfuse announced a series of silicon Schottky devices designed for ultra-low forward voltage drop (VF), which are well-suited for use in high-frequency applications.

What it delivers

This component is designed for high frequency application such as switch-mode power supplies, as well as DC applications such as solar panel bypass diode and polarity protection diodes.

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DST Series Schottky Diodes
DST Series Schottky Diodes

By delivering performance superior to conventional switching diodes, they offer high junction temperature capability, low leakage and ultra-low forward voltage drop. Their higher junction temperature capability and low leakage provide higher reliability in harsh, high-temperature environments.

 

“The DST Series’ ultra-low forward voltage drop performance is an important new addition to the growing Littelfuse power semiconductor device offering,”

— Corey Deyalsingh, director of power control semiconductors at Littelfuse

DST Series Schottky Barrier Rectifiers offer these key benefits:
• Their ultra-low forward voltage drop (VF) reduces thermal and electrical conduction losses, thereby improving system efficiency.
• Because they provide fast switching, they can be used in very high frequency applications with minimal switching loss.
• Their high junction temperature capability ensures high reliability in high ambient temperatures or in applications with minimal cooling available.

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Availability

DST Series Schottky Barrier Rectifiers are available in a variety of package types and sizes, including TO-263 (D2PAK), ITO-252 (DPAK), ITO-220AB, TO-220AB, TO-220AC, P600, PDFN5x6-8L, and TO 277B. They are sold in reels or tubes, depending on the package type selected. Sample requests can be placed through authorized Littelfuse distributors worldwide.[/restrict]

Dilin Anand
Dilin Anand
Dilin Anand is the Senior Vice President at Electronics For You Group, where he plays a key role in connecting the global engineering ecosystem with India’s rapidly evolving electronics and technology landscape. A core member of the EFY editorial team since 2011, he has been instrumental in shaping content, strategy, and industry engagement across the group’s platforms. With over a decade of experience in technology publishing and ecosystem building, Dilin focuses on bridging the gap between engineers, innovators, and industry stakeholders. His work spans editorial leadership, strategic partnerships, and initiatives aimed at empowering the engineering community with relevant, high-quality knowledge and opportunities. He has also completed the Venture Advancement Program in Entrepreneurship and Entrepreneurial Studies at Massachusetts Institute of Technology, strengthening his perspective on innovation, startups, and technology-driven growth. Dilin is particularly passionate about enabling knowledge exchange, fostering collaboration, and supporting the growth of India’s engineering ecosystem through impactful content and initiatives.

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