The computer module handles processing, runs AI tasks, and connects to devices—useful for robots, machines, medical tools, and sensors.
ADLINK Technology Inc., a company in edge computing, announces the launch of the COM-HPC-mMTL, a small form factor module with Intel Core Ultra architecture and multiple I/O options. This makes it suitable for edge applications that require processing and connectivity.
The module is designed for developers, engineers, and system integrators working on embedded and edge computing solutions in space-constrained environments. It supports use cases in industrial automation, where processing and I/O are needed for functions such as machine control and monitoring. Developers of UAVs and AI-based robots can apply its compact size, AI acceleration, and thermal tolerance in autonomous systems and field-deployed devices.
Medical device manufacturers can integrate the module into diagnostic tools like ultrasound machines, making use of its processing capability and board configuration. The module also enables embedded systems in environments with limited space, offering a combination of compute resources, scalability, and a stackable design that supports various edge deployment needs.
The module features up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for AI acceleration. It supports applications such as industrial automation, data loggers, UAVs, medical ultrasound devices, and AI-based robots.
The module includes up to 64GB LPDDR5x memory soldered on board, running at 7467MT/s, to support performance and efficiency. Its 95mm x 70mm size allows installation in space-limited environments. Selected SKUs support an operating temperature range of -40°C to 85°C.
Despite its small size, the module includes 16 PCIe lanes, 2 SATA interfaces, two 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, offering a broad range of I/O options for various use cases.
“The COM-HPC-mMTL is not just another embedded module. It redefines what’s possible in edge computing with its exceptional performance and efficiency in such a compact form,” says Alex Wang, Senior Product Manager.
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