Friday, December 5, 2025

Smaller BJTs For Cars And Machines

Twelve new small BJTs cut space and cost for cars and machines. They work in heat and are used in cars, chargers, and power tools.

Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors
Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors

Nexperia has introduced 12 new MJD-style bipolar junction transistors (BJTs) in space-saving CFP15B packaging. These new MJPE-series devices are designed to meet the industry’s need for more power-efficient and cost-effective components in automotive and industrial systems.

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The MJPE-series BJTs offer a 53% smaller soldering footprint compared to traditional DPAK-packaged MJD transistors, without sacrificing electrical or thermal performance. They also reduce board space and overall system cost.

The portfolio includes six automotive-grade parts (e.g., MJPE31C-Q) and six industrial-grade versions (e.g., MJPE44H11). Voltage ratings include 50 V, 80 V, and 100 V, with collector current options of 2 A, 3 A, and 8 A. Both NPN and PNP types are available.

These transistors are ideal for applications such as battery management systems (BMS), on-board chargers in electric vehicles (EVs), and backlighting in video displays. All devices support high-temperature operation up to 175°C for automotive use.

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Built using clip-bonded CFP15B packaging, the new BJTs benefit from enhanced thermal performance and mechanical robustness. The MJPE series also aligns with Nexperia’s broader CFP product range, which includes Schottky and fast-recovery rectifier diodes—enabling standardized footprints and simpler PCB and supply chain design.

“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging has become a crucial part of the thermal system,” according to Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. “Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance in a considerably smaller footprint, helping to reduce part and overall system costs. Nexperia has substantially expanded its capacity to meet the increasing demand for CFP-packaged products that are essential for future-proofing automotive and industrial applications, including the MJPE series of BJTs.”

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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