HomeElectronics NewsFactory-built modular design promises faster AI data centre expansion

Factory-built modular design promises faster AI data centre expansion

Building AI data centres could soon become faster, simpler and more scalable as a modular approach cuts deployment times while supporting future capacity growth.

KAYTUS has unveiled a factory-prefabricated, liquid-cooled modular data centre solution designed to speed AI infrastructure deployment and support expansion from 3MW installations to gigawatt-class facilities. Introduced at the ISC 2026 supercomputing conference in Hamburg, Germany, the solution integrates computing, power and cooling systems into prefabricated modules that are assembled before arriving on site.

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The architecture is divided into three standardised units: the IT Cube, Power Cube and Cooling Cube. According to KAYTUS, manufacturing and validating the modules off-site reduces construction complexity, shortens deployment from 18–24 months to six to eight months and allows a 3MW installation to begin operations within a month of delivery.

The IT Cube accommodates 18 liquid-cooled racks supporting up to 227kW per rack and incorporates integrated spine-leaf networking. The Power Cube uses independently prefabricated 2,500kVA power transfer units and diesel generators in a 2+1 redundant, Tier III-compliant configuration to maintain uninterrupted power during battery-to-generator transitions.

Cooling is provided through a 4,200kW liquid-cooling source and a 3,300kW chilled-water plant, backed by a thermal buffer tank and a 72-hour emergency water reserve. The company said every module undergoes factory integration, pressure testing and system validation before shipment, reducing on-site engineering work and deployment risks.

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The modular design also supports phased expansion without major changes to existing infrastructure. Starting from a 3MW base unit, operators can scale progressively to 100MW and eventually gigawatt-class AI data centres while maintaining a consistent power and cooling architecture under a single-vendor deployment model.

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T Pavani
T Pavani
T Pavani is a Tech Journalist at ElectronicsForU.com with a deep interest in embedded systems, IoT, robotics, AI/ML, VLSI, and emerging technologies.

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