HomeElectronics NewsSimulation Software Speeds Up Product Design

Simulation Software Speeds Up Product Design

The software update adds AI tools and simulation features, helping engineers test more designs, find problems earlier, and reduce product development time.

Siemens accelerates engineering simulation with a unified AI-powered Simcenter portfolio
Siemens accelerates engineering simulation with a unified AI-powered Simcenter portfolio

Siemens has released a new version of its Simcenter simulation software, adding AI features, faster simulation tools, and closer integration across its engineering software portfolio. The update is also the first to combine simulation technologies from Siemens and Altair into a single portfolio, helping engineering teams work across different physics domains with more connected workflows.

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The release is designed to help engineers evaluate more design options in less time, reduce simulation complexity, and identify design issues earlier in the development process. The software also improves collaboration between mechanical, thermal, electromagnetic, and system-level simulations.

A major addition is the wider integration of Simcenter PhysicsAI, Siemens’ geometric deep learning technology that converts simulation data into predictive AI models. Instead of running repeated simulation cycles, engineers can use these models to evaluate new designs much faster. According to Siemens, the technology can deliver results up to 1,000 times faster than traditional solver-based simulations for suitable applications.

The release also introduces Simcenter PhysicsAI Generate, a physics-aware generative AI tool that creates new design concepts from existing engineering data. Engineers can generate alternative designs based on target dimensions, performance requirements, and historical simulation data within seconds, allowing faster design exploration.

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The software update also brings simulation earlier into the product development process. Integration between Simcenter Simsolid and Designcenter allows engineers to perform structural simulations directly on CAD geometry without creating a mesh, reducing simulation preparation time and enabling faster performance evaluation.

Siemens has also expanded its multiphysics simulation capabilities by improving connections between electromagnetic, thermal, fluid, and system-level simulations. Engineers can now export reduced motor models from Simcenter Flux into system and 3D simulation tools, while updates in Simcenter STAR-CCM+ improve analysis of applications such as electric motor cooling and battery thermal management.

The updates aim to provide a connected simulation environment that supports faster product development, earlier design validation, and collaboration across engineering teams. The unified Simcenter portfolio is part of the Siemens Xcelerator platform, bringing AI-assisted simulation and integrated engineering workflows into a single software ecosystem.

Click here for the original announcement.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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