A new system helps factories apply materials evenly on large panels used to make advanced semiconductor packages.
Nordson Electronics Solutions has introduced the ASYMTEK Vantage XL fluid dispensing platform for panel-level packaging (PLP) and other advanced semiconductor packaging applications.
The system builds on Nordson’s Vantage dispensing platform and supports larger panel formats. It is designed to help manufacturers scale advanced packaging processes while maintaining dispensing accuracy, production speed, process control, yield and flexibility. The Vantage platform also combines high-speed jetting, automated calibration and process control technologies for wafer, substrate and panel-level applications.
Panel-level packaging can increase production output and reduce manufacturing costs compared with wafer-level processes. However, working with larger panels brings challenges such as panel warpage, temperature control and dispensing accuracy. These issues become more important as demand grows for advanced packaging used in AI, high-performance computing and automotive applications.
The ASYMTEK Vantage XL addresses these requirements with features aimed at improving dispensing and substrate handling. It can process panels up to 510 × 515 mm and can accommodate additional panel sizes through custom tooling. Its integrated thermal management is designed to improve underfill flow, minimise panel warpage and maintain temperature uniformity across the panel.
The system also uses dual-valve IntelliJet jetting and patented real-time dispense correction to improve dispensing accuracy and yield. Automated multi-fiducial recognition supports panel alignment, while confocal height sensing enables dispensing on reflective and transparent glass panels. An integrated post-dispense inspection function can help identify defects, reducing scrap and supporting rework.
The broader Vantage platform can dispense into die-to-die gaps below 200 μm and avoid keep-out zones below 250 μm. It also includes automated calibration, closed-loop process controls, traceability and Industry 4.0-ready connectivity. Programming and process monitoring are handled through Canvas fluid dispensing software, which supports graphical programming, guided setup, sensor and process data access, and offline programming.
The Vantage XL uses the same Vantage platform in a larger frame designed for large-format panel-level packaging, where panel flatness, temperature uniformity and throughput are important for maintaining production yield.
Click here for the original announcement.
