The new carrier board combines three QMC sites, PCIe connectivity, rear I/O, and rugged cooling to simplify modular defence and aerospace system integration across next-generation embedded platforms.
TEWS Technologies has announced the TVPX210, a 3U OpenVPX carrier board designed to align with the SOSA Technical Standard and support modular I/O integration in next-generation defence and aerospace platforms. The carrier provides three VITA 93 QMC sites, enabling system designers to configure application-specific I/O while retaining a common carrier architecture.
The TVPX210 supports up to three single-width QMC modules, a double-width module combined with a single-width module, or a single triple-width module. This modular configuration allows system architectures to accommodate different I/O requirements without changing the carrier design.
A non-blocking PCI Express Gen3 switch provides high-speed communication between the VPX backplane and installed QMC modules. Each QMC site supports a PCIe Gen3 x4 interface, while the carrier provides a PCIe Gen3 x2 host interface. Complete QMC I/O is routed through the VPX P1 and P2 rear-I/O connectors.
For system management, the carrier incorporates a VITA 46.11-compliant management controller supporting IPMI 2.0. It enables health monitoring, inventory management, and communication with the VPX System Manager, helping simplify integration and maintenance.
The board uses a 3U VPX form factor and a conduction-cooled VPX REDI implementation compliant with ANSI/VITA 48.2. It supports the SLT3-PAY-2U2U-14.2.17 OpenVPX profile and operates from -40°C to 85°C, targeting rugged embedded deployments.
The modular architecture is intended to reduce development effort and simplify future technology upgrades while supporting long platform lifecycles. TEWS positions the TVPX210 for defence and aerospace systems requiring configurable I/O, high-speed data movement, and rugged operation. The manufacturer currently lists the product status as in development.
