HomeElectronics NewsPower Resistor Supports Top-Side Cooling

Power Resistor Supports Top-Side Cooling

A top-side cooled resistor helps designers manage heat, handle power, and reduce PCB space in automotive circuits.

PR44185400-D2TO35S_300dpi_gray
PR44185400-D2TO35S_300dpi_gray

Vishay Intertechnology has introduced the Vishay Sfernice D2TO35S, an automotive-grade thick-film power resistor with top-side cooling. The surface-mount resistor can dissipate up to 35 W at 25 °C in a TO-263 (D²PAK) package when used under the specified conditions.

The resistor is designed to move heat away from the PCB by transferring it directly to a heatsink mounted on its top side. With an appropriate heatsink, the D2TO35S can provide up to nine times the power dissipation of standard PCB-mounted resistors.

This approach allows automotive electronics designers to either increase power dissipation within the same board footprint or achieve the required power handling using less board space. Moving heat away from the PCB can also help lower PCB temperatures and reduce thermal stress on nearby components.

The D2TO35S uses a non-inductive design, making it suitable for circuits where signal integrity and power handling are important during fast transient conditions. It is available with resistance values from 4.7 Ω to 550 kΩ and tolerances down to ±1%.

The resistor has a thermal resistance of 4.28 °C/W and a temperature coefficient of resistance (TCR) down to ±150 ppm/°C. It operates across a temperature range of -55 °C to +175 °C.

The device is RoHS compliant and can withstand solder reflow temperatures of up to 270 °C for 10 seconds.

Automotive electronics designers can use the D2TO35S in systems where resistors need to handle higher power without transferring as much heat to the PCB. A heatsink can be added to increase power dissipation, maintain the required power handling within an existing board footprint, or reduce the space required for the resistor.

The resistor can be used in automotive circuits where thermal management, power dissipation, signal integrity, and PCB space are important design requirements. Its non-inductive construction also makes it suitable for applications exposed to fast transient conditions.

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Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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