HomeTech ZoneTech of Processors2nd Gen 5G NR Modules Compliant With 3GPP R16 Standard

2nd Gen 5G NR Modules Compliant With 3GPP R16 Standard

Sub-6GHz modules support TDD and FDD carrier aggregation (CA), which ensures greater 5G coverage, capacity and throughput

Based on the latest Qualcomm Snapdragon X65 and X62 5G Modem-RF Systems, are the new second-generation 5G new radio (NR) modules. They include sub-6GHz modules Rx520F and the Rx520N series as well as the RM530x series of mmWave modules.

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Complying with the 3GPP Release 16 standards, these modules meet industrial needs for enhanced mobile broadband and reliable communication. The modules also speed up the commercialisation of 5G technologies and bring the benefits of mobile broadband to typical scenarios including Fixed Wireless Access, Industrial IoT, Mobile Compute, telemedicine, private networks and more.

New 5G NR sub-6GHz modules include the RG520F (LGA), the RM520F (M.2) based on Snapdragon X65 and the RG520N (LGA), the RM520N (M.2) based on Snapdragon X62. Also offered are second-generation modules that support sub-6GHz and mmWave dual connectivity, the RM530F and RM530N modules (M.2).

The 5G products deliver better link reliability and ultra-low latency, which is expected to accelerate the commercial deployment of 5G applications such as industrial IoT, factory automation and connected vehicles.

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The high-end Snapdragon X65 based modules can support fibre-like peak download speeds up to 10Gbps, which can address specific 5G eMBB use cases requiring extremely high data rates, such as 4K/8K ultra high definition (UHD) live steaming.

These modules are now available from Quectel Wireless Solutions.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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