Reference design provides a high-density 50 V power supply using surface-mounted silicon carbide devices for server and telecommunications applications.
Toshiba Electronic Devices & Storage Corporation has developed a 3 kW power supply reference design for servers and telecommunications equipment. The design uses surface-mounted silicon carbide (SiC) devices and separates the power supply from the main board as a sub-board to achieve higher power density. It is also suitable for other systems using 48 V power architectures.
The reference design accepts an AC input voltage ranging from 180 V to 264 V and provides a 50 V DC output with a maximum output power of 3 kW. Its power-conversion architecture combines semi-bridgeless power factor correction, a phase-shift full-bridge converter with synchronous rectification, and an output ORing circuit. The design achieves a total efficiency of 94.8 per cent at a 230 V input under full-load conditions.
The design uses surface-mounted SiC MOSFETs and SiC Schottky barrier diodes in the power factor correction stage. The phase-shift full-bridge stage also incorporates SiC MOSFETs, while additional silicon MOSFETs are used for synchronous rectification and output ORing. Toshiba states that adopting surface-mounted devices improves power density by 34 per cent compared with its existing design.
The reference design integrates a digital isolator in the phase-shift full-bridge circuit and is designed as a sub-board to help achieve a compact implementation. Toshiba provides information explaining the circuit operation, design considerations and adjustment methods for the different sections of the power supply. This allows engineers to examine the implementation and evaluate the architecture for high-power server and telecommunications systems.
Toshiba provides supporting design resources including a reference guide, design guide, circuit diagrams, bill of materials and PCB layer information. Circuit and PCB design data are also available in formats compatible with multiple electronic design automation tools, along with PCB fabrication data in Gerber and ODB++ formats. These resources provide engineers with the information needed to study, evaluate and adapt the 3 kW power-supply architecture for suitable applications.
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