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AI Without Cloud For Industrial Systems

Many edge systems cannot run AI due to power and heat limits. This module enables local AI, real-time processing, and flexible system design.

Computer-on-Modules for an efficient entry into rugged embedded edge AI applications
Computer-on-Modules for an efficient entry into rugged embedded edge AI applications

Many industrial and edge systems cannot run AI locally because of limits in power, heat, space, and reliability. This affects systems used in transport, medical devices, smart city infrastructure, robotics, gaming, point-of-sale, and factory automation. To address this, congatec has introduced a new COM Express Type 6 Compact module designed to enable local AI processing in compact systems that operate across a wide temperature range.

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The module delivers up to 59 TOPS of AI performance, enabling real-time inference without cloud access or external accelerators. This supports use cases such as vision processing, automation control, and on-device data analysis. The operating range of –40 to +85 °C allows use in outdoor, mobile, and industrial settings.

Power use is managed through a configurable TDP range of 15 to 54 W. This helps system designers balance performance, cooling, size, and cost. Low TDP settings support passively cooled and sealed systems, suitable for handheld devices, medical PCs, and equipment used in controlled or exposed environments.

The module combines performance and efficiency CPU cores with an integrated GPU and NPU. This supports real-time workloads, consistent execution timing, and deterministic behavior, which are needed for industrial control and robotics. It also supports up to four 4K displays for system interfaces.

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The integrated NPU allows local processing of AI workloads, including vision tasks and smaller language models. This reduces data transfer, lowers latency, and removes the need for cloud connectivity or external hardware.

Memory support includes up to 96 GB of DDR5 with optional ECC. Connectivity includes PCIe Gen4 lanes, Ethernet, USB, SATA, and NVMe storage. This enables connection to cameras, sensors, industrial networks, and expansion modules, allowing system designs to scale without hardware changes.

“With the increasing demand for rugged edge applications with or without AI, there is also a growing need for entry-level COM variants with 4 and 6 cores for power- and cost-optimized designs. The conga-TCRP1 expands congatec’s comprehensive portfolio for precisely these application areas, targeting cost-sensitive designs that require optimal performance per watt,” said Florian Drittenthaler, Product Line Manager at congatec. 

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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