Monday, July 22, 2024

High-Speed Line Inspection With AI-Powered Algorithms

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Discover the future of PCB assembly with an industry 4.0-ready platform and innovative solutions for hidden solder joint defects.

Test Research, Inc. (TRI) will participate in the IPC APEX EXPO 2024 at the Anaheim Convention Center from April 9 to 11, 2024. At the expo, it will introduce the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, which can inspect at speeds of up to 80 cm²/sec while maintaining uncompromised Gauge R&R. The TR7700QH SII features TRI’s AI-powered Inspection Algorithms and Metrology measurement capabilities. The optical system employs a stop-and-go imaging method with a top camera featuring a 21 MP high-speed sensor. It achieves imaging resolution as fine as 15 µm and utilizes multi-phase true-color LED lighting. 3D capabilities are enabled by quad digital fringe projectors, offering a maximum 3D range of 40 mm. The key features include:

  • Ultra-High-Speed Camera, up to 80 cm2/sec
  • Metrology-Grade Measurements
  • AI-powered Algorithms with Smart Programming
  • Industry 4.0 Ready Platform

The board handling specifications include a maximum PCB size of 510 x 510 mm, while the TR7700QH SII DL can handle PCBs up to 510 x 310 mm x 2 lanes or 510 x 590 mm x 1 lane. It accommodates PCBs up to 765 x 610 mm. PCB thickness ranges from 0.6 to 5 mm, with a maximum weight of 3 kg, with an optional upgrade to 5 kg or 12 kg for the latter. The top clearance is 50 mm, bottom clearance is 40 mm, and edge clearance for the TR7700QH SII (DL) is 3 mm, with optional upgrades to 4 mm or 5 mm, while the TR7700L QH SII offers a 3 mm edge clearance, upgradable to 5 mm. The conveyor height for both models ranges from 880 to 920 mm, with optional heights of 940 to 965 mm

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The systems are SMEMA compatible and offer a range of inspection functions for components and solder, ensuring high-quality PCB assembly. The dimensions vary with the model, with the TR7700QH SII measuring 1100 x 1730 x 1700 mm, the TR7700QH SII DL measuring 1100 x 2005 x 1700 mm, and the TR7700L QH SII measuring 1365 x 1865 x 1700 mm. Note that these dimensions do not include the signal tower, which has a height of 520 mm. The weights of the machines are 920 kg for the TR7700QH SII, 1020 kg for the TR7700QH SII DL, and 1035 kg for the TR7700L QH SII.

TRI will also feature the latest multi-angle 3D AOI, TR7500QE Plus, which is designed to detect hidden solder joint defects. Their lineup includes the enhanced 3D SPI TR7007Q SII, the high-throughput 3D AXI TR7600 Series, and the Multi-core ICT TR5001Q SII INLINE. Additionally, TRI offers AI-powered solutions such as the AI training tool, AI Station, Verify Host, and AI Smart Programming, all compliant with Smart Factory standards like IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.

For more information, click here.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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