A newly launched inspection platform brings expanded board handling capabilities to meet the rising demand in sectors like electric vehicles and high-performance computing—offering smarter, scalable solutions for next-gen electronics manufacturing.
Test Research, Inc. (TRI), leading provider of test and inspection systems for electronics manufacturing, has unveiled a new size configuration designed to enhance SPI and AOI platforms for larger PCB applications. As electronic assemblies get larger and more complex—think EV batteries, server boards, and power modules—so do the demands on inspection technology. TRI’s new Size M configuration steps up to meet these demands. With board handling capabilities up to 660 x 690 mm, it allows manufacturers to inspect larger boards without compromising on precision or speed.
This enhancement is available across multiple popular models:
- SPI: TR7007M SIII and TR7007MD/Q SII
- AOI: TR7700MQ SII, TR7700M SIII Ultra, TR7500M SIII Ultra, and TR7700MQC SII
The platforms aren’t just about scale—they’re smart, too. These systems are fully compatible with leading Industry 4.0 and Smart Factory protocols, including SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852. That means seamless data exchange, smarter defect detection, and smoother line integration—whether you’re upgrading a single station or planning a full digital transformation.
Whether you’re building for EVs, datacenters, or heavy industrial electronics, it offers greater versatility without requiring a whole new production line. It’s a cost-effective, plug-and-play upgrade to existing SPI and AOI processes that enables broader inspection coverage while maintaining the company’s reputation for accuracy and reliability.
With the new Size M configuration, the company reaffirms its leadership in inspection innovation—empowering manufacturers to take on today’s largest and most complex boards with confidence, compliance, and a clear path to smarter manufacturing.
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