Fast Application Development Using Dual-Band Wi-Fi 4 And Bluetooth 5

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Compact size and design flexibility makes it ideal for size-constrained applications that operate in harsh industrial environments

Built for facilitating the development of fast-growing, future-oriented applications, such as power management, electric vehicle charging, professional appliances, industrial automation, tracking, predictive maintenance, telematics and fleet management, here’s presenting the robust, flexible and reliable MAYA-W1 Wi-Fi 4 and Bluetooth 5 multi-radio module. It is based on NXP’s IW416 chip and offers product designers short-range connectivity that is both cost-effective and simple to implement.

Qualified for operation up to 85 degrees Celsius and having a small form factor of 10 x 14 millimetres, the MAYA-W1 is ideal for size-constrained applications that operate in harsh industrial environments. Besides the above, other application areas include connected healthcare, smart homes and retail.

With more and more connected devices competing for Wi-Fi spectrum in the 2.4 GHz band, robust performance in congested environments has become an important differentiator. Featuring Wi-Fi 4 (802.11a/b/g/n) dual-band 1×1 SISO, MAYA-W1 can select Wi-Fi channels from the entire 2.4 GHz and 5 GHz Wi-Fi spectrum, reliably connecting end devices and access points even when the bandwidth is limited.

In addition to offering Wi-Fi 4 and dual-mode Bluetooth (Bluetooth low energy and Bluetooth classic) in a single hardware component, pre-integration of the module’s firmware and driver in NXP’s MCUXpresso development environment simplifies product development.

“Wi-Fi 4 continues to be the most used technology in our target segments, but there is concern over congestion of the 2.4 GHz band. With its dual-band capability, MAYA-W1 addresses these concerns head-on, strongly positioning it in the broad IoT segment,” says Stefan Berggren, Senior Product Marketing Manager, Product Center Short Range Radio at u-blox.

“We are excited to see u-blox build their MAYA-W1 module around the NXP IW416 dual-band Wi-Fi 4 and Bluetooth 5 chipset and our i.MX RT series of MCUs. We see great potential for this combination of technologies for many existing industrial and consumer applications,” says Tom Eichenberg, Director of Product Marketing at NXP.

Samples of the module and EVKs will be available by April 2021 from u-blox.


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