Friday, June 21, 2024

iWave’s launches Solderable i.MX8XLite LGA SOM for V2X, and Industrial Control

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iWave Systems launches a Solderable System on Module based on the NXP i.MX 8XLite applications processor

iWave Systems systems have released iW-RainboW-G46M, the solderable i.MX8XLite LGA System on Module (SOM). This SOM is developed for application in Industrial IoT, connected and autonomous vehicles, and V2X. The main advantages of the OSM module include is its compact size, high resistance to vibration, and provision for technology scalability. Therefore, the OSM Modules provide designers with a solution with an ideal mix of scalability, form factor, and cost. It features high-speed interfaces such as Ethernet, PCIe Gen3, USB 2.0, and CAN Ports, and is powered by 2 x Cortex A-35 cores and 1 Cortex-M4 core. The processor is available in both the single and dual-core variants.

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The solderable i.MX 8XLite LGA SOM is built on the OSM 1.0 Standard. It has 332 contact points and comes in a compact form factor of 30mm x 30mm. The module is AEC compliant and built for the next frontier of automotive and transportation solutions. The company claims it to be the first i.MX Processor to include an on-chip V2X accelerator, while integrated with the V2X Optimized High-Security Module (HSM) and Secure Hardware Extension (SHE). The processor satisfies the safety and performance requirement for Vehicle-to-Everything (V2X) which includes Vehicle-to-Vehicle (V2V), Vehicle to Infrastructure (V2I), and Vehicle to Network (V2N) solutions.

“Integrating the powerful NXP i.MX 8XLite application processor in the solderable system on the module form factor of the recent OSM Standard, the SoM can be a building block for compact connectivity devices,” said Ahmed Shameem M H, Hardware Project Lead at iWave Systems. “The AEC grade module is power-efficient and easily upgradable to power next-generation of connected mobility and smart city solutions.”

The OSM Standard defines a standard for a system on the module to be soldered on the carrier board as a solder-on module LGA package, by the replacement of board-to-board connectors. The replacement makes the module more robust and improves the resistance to vibration, moreover, it helps in achieving a compact form factor which enhances technology scalability and makes this module achieve the smallest pin to area ratio and provision. Thus, these OSM Modules provide designers with a solution with an ideal mix of scalability, form factor, and cost.

Key Features of iW-RainboW-G46M

  • MX 8XLite Solo/Dual
  • 2GB LPDDR4 Memory (Expandable)
  • 8GB eMMC Flash (Expandable)
  • CAN Ports x 2
  • RGMII x 1
  • PCIe x 1
  • GPIO x 15
  • Size-SE: 30mm x 30mm
  • AEC Grade
  • -40°C to +125°C Operating Temperature


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