Wednesday, September 28, 2022

Low Loss Laminate For 5G Infrastructure And Computing Applications

By Jay Soni

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Isola has introduced extremely low loss laminates with electrical properties that are stable over a broad frequency and temperature range.

No matter how much efficiency you read on the product description, a certain amount of energy will always be lost. Electronic devices work on voltages and electromagnetic fields(EMF). The EMF gives rise to eddy currents which are basically mostly lost and not utilized.

Image depicting an electronic circuit board with a layer of lamination. |  Credit : Mitsubishi

Isola has introduced TerraGreen 400G, an extremely low loss laminate that is designed for next-generation 5G infrastructure and computing applications. The laminate exhibits exceptional electrical properties which are very stable over a broad frequency and temperature range. It is engineered for high-performance applications as power amplifier boards for LTE base stations, internet infrastructure, and cloud computing. It has a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to W-band.

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The laminate is made from a high-performance, lead free, and easy to process material. It is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. The laminate can be processed utilizing standard PCB equipment and processing steps. TerraGreen is suitable for the high-layer count, and high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. It meets UL 94 V-0 and is halogen-free.

Features
  • Dk (Dielectric Constant) : 3.05
  • Df (Dissipation Factor) : 0.0018
  • Td : 400 Degrees C
  • Tg : 210 Degrees C
  • CTE x-y : 12 ppm/°C
  • CTE z : 2.8%
  • Applications : Computing, Storage & Peripherals, Networking & Communication Systems
  • Flammability : V-0
  • Grade : Commercial
  • Industry Application : Aerospace & Defense
  • Peel Strength : 0.65 N/mm

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