High-Reliability 3D AOI Solution For Semiconductor & Packaging Industry

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Meeting the increased miniaturisation of components, the high-resolution inspection platform enables high accuracy and reliability

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability TR77000QM SII 3D AOI.

The TR7700QM SII is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry and other high-reliability industries.

As the miniaturisation of components and PCB boards increases, the demand for resolution inspection increases; TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false call rates. TRI’s 3D AOI technologies range from Depth from Focus (DFF), 3D Blue Laser and Moiré projection for virtually Zero-escape Inspection.


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