Thursday, October 28, 2021
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Built on the award-winning TR7007 SII Plus Series, the new equipment can accurately inspect low solder bridges Test Research, Inc. (TRI) presents the new 3D high-speed solder paste inspection (SPI) solution TR7007 SII Ultra that can perform at an industry-leading...
Offers high accuracy, fast speeds and minimised downtime using deep learning, thereby reducing human errors, false calls and operator costs The newly released 3D SPI TR7007Q Plus by Test Research Inc. (TRI) is equipped with an improved motion controller and...
Meeting the increased miniaturisation of components, the high-resolution inspection platform enables high accuracy and reliability Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability...