HomeElectronics NewsNext-Generation Tester For High-Power Chips

Next-Generation Tester For High-Power Chips

The tester for high-power chips using Silicon Carbide and Gallium Nitride offers efficient testing with high voltage, current capacity, and parallelism.

MICROTEST LAUNCHES NEW ‘VIP ULTRA’ TESTER AT THE SEMICONDUCTOR TRADE FAIR IN ATLANTA
MICROTEST LAUNCHES NEW ‘VIP ULTRA’ TESTER AT THE SEMICONDUCTOR TRADE FAIR IN ATLANTA

The Microtest Group, a European manufacturer of test systems for chips on packages and silicon wafers, have launched the VIP ULTRA tester. It is the latest version of Microtest’s VIP Extended product line, designed for testing Wide Band Gap (WBG) devices made from compound semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN). These materials are widely used in power electronics due to their ability to handle high currents and voltages efficiently.

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The demand for WBG-based devices is increasing in industries such as automotive and industrial electronics, particularly in electric and hybrid vehicles, solar inverters, 5G infrastructure, and data centers. These technologies must support the growing computational requirements of AI and ML applications.

The company has developed the VIP ULTRA to offer enhanced operational flexibility for power electronics testing in industrial applications. The tester supports multiple configurations, with voltage capabilities of 1.7KV or 4KV and current capacities up to 250A.

It is the only test platform available that provides a complete suite of tools for DC and energy stress testing with high parallelism—32 channels in the 1.7KV configuration and 16 in the 4KV configuration. These capabilities make it particularly effective for testing high-power chips at the silicon wafer level, ensuring proper functionality before chip dicing and integration.

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“With VIP ULTRA, we are driving innovation in high-power device testing with a more efficient and market-advantageous test platform. An increasing number of applications, from the automotive sector to data centers, require electronic devices capable of efficiently handling high power levels. This demand also drives test platforms to evolve, supporting higher voltages while maximizing production capacity. Numerous private and governmental entities are investing in new factories, facilities, and research centers to develop new materials and technologies that address emerging industrial applications,” said Emiliano Consani, Head of the ATE Business Unit at Microtest Group.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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