HomeElectronics NewsPackaging Lines Get a More Serviceable Applicator

Packaging Lines Get a More Serviceable Applicator

An adhesive system makes maintenance easier, reduces waste, helps prevent clogs, and keeps packaging lines running with fewer stops.

Nordson Packaging has introduced the new Blue Series II Applicators for packaging applications. The Blue Series Applicator is already used across the packaging industry. The Blue Series II builds on the earlier design with updates aimed at improving reliability, maintenance, and production uptime. The new applicator combines an updated design with cleaner operation and easier servicing.

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The Blue Series II includes integrated filtration to help extend system life, upgraded cordsets to simplify troubleshooting, and a streamlined solenoid concept that makes component selection and replacement faster and easier. Maintenance tasks can be carried out more efficiently, with one tool used for module replacement, solenoid valve changes, filter changes, cordset replacement, and bar clamp position adjustment.

Components can also be replaced quickly, while the Quick-Change solenoid valve is designed to minimise downtime during servicing.

Nordson has also introduced the SureBead II and SolidBlue II modules as the next versions of the Blue Series family. SureBead II is designed to provide clog-free, self-cleaning performance, while SolidBlue II is designed to deliver a clean, round cut-off.

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Both modules use optimised seals, precision-machined needle tips, and larger weep areas to extend service intervals and support consistent application quality. They also feature Air Open-Air Close technology for precise cut-off, reduced material waste, and repeatable results.

The Blue Series II system is backwards compatible with Blue Series I. The enhanced cordset, upgraded solenoid, and integrated filtration are designed to further improve reliability for packaging lines that require consistent quality, lower maintenance needs, and maximum uptime.

Click here for the original announcement.

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Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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