Sunday, April 21, 2024

RFID Die Bonder Enhances Industry Standards

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The RFID inlay die bonder offers speed, precision, and versatility for retail and aerospace applications, impacting the manufacturing industry significantly.

RFID die bonder

ITEC’s ADAT3 XF Tagliner is an RFID inlay die bonder with high speed and accuracy. It achieves placement speeds of up to 48,000 Units Per Hour (UPH), with positional and rotational accuracies of less than 9 micrometres and 0.67º at one sigma. This performance makes it faster and more accurate than other die-bonding equipment. The tagliner is fully automated, with yields over 99.5%. It has a low Total Cost of Ownership for this type of equipment and can reduce manufacturing costs. The equipment is suitable for various RFID applications in multiple sectors, including labels for retail and automotive, access control systems, railway tickets, airline luggage tags, and shipping containers.

The press release says that the tagliner incorporates features typical in the semiconductor industry, such as automatic wafer change for 8- and 12-inch wafers and multiple high-resolution cameras for inspection at each process step. The RFID inlay die bonder can work with transparent and opaque web materials, unlike other RFID die bonding equipment limited to transparent materials. It includes BW Paper systems winders and Voyantic readers, making it compatible with new and more sustainable substrates like paper, which are increasingly replacing PET plastics.

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Some of the key features of the RFID inlay die bonder include:

  • Performance: Up to 60.000 units per hour
  • Supports 8 to 12 inches wafer on frame film carrier
  • Tape width: 8 – 12 mm
  • Sidewall inspection
  • Die size: Minimal- 0.2 x 0.4 mm, Maximal- 5 x 5 mm
  • High throughput at a high-volume manufacturing rate
  • APR auto-product replace
  • In-tape inspection
  • Automatic reel changer: optional
  • Full die traceability: tape–wafer
  • Auto recipe download (MES interface)
  • SECS/GEM interface with E142

“This RFID die bonder has been optimised by leveraging semiconductor industry innovations and is likely to be the benchmark system over the coming years,” states Martijn Zwegers. Ongoing upgrades throughout the lifespan of the ADAT3 XF Tagliner will enhance its operation and performance, securing the value of the current investment for the future.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.

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