Sunday, May 19, 2024

Video Processor For Advanced AI And Computational Imaging Capabilities

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The new AVP, notable for its industry-leading size, weight, and power (SWaP), utilizes advanced Prism AI and ISP software libraries to enhance drone, robot, and security camera payload capabilities.

Teledyne FLIR has introduced the AVP, an advanced video processor that enhances the capabilities of its Prism AI and computational imaging technology. The AVP is built with the Qualcomm QCS8550, the latest and most sophisticated mobile processor chip available, which is renowned for its application in mobile, automotive, and robotics technologies.

This processor stands out for delivering  artificial intelligence (AI) performance in a compact, lightweight, and energy-efficient unit, making it ideal for integration with thermal and visible cameras in various devices. These include unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.The advanced perception software, Prism AI, is trained on a thermal image dataset with over 5 million annotations and supports a broad spectrum of popular visible cameras. The key features include:

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  •  Operatesthe company’s proprietary Prism AI and ISP software libraries.
  •  Compatible with Boson and Neutrino thermal infrared imaging camera modules.

This software is proficient in identifying, classifying, and tracking objects, facilitating a range of applications. These applications include automotive autonomy, automatic emergency braking systems, aerial camera payloads for various aircraft, counter-drone systems, and comprehensive surveillance and reconnaissance missions. Each feature is designed to enhance the functionality and versatility of the technology in complex environments and demanding operational scenarios.

The Prism ISP suite offers various image processing algorithms, including super-resolution, image fusion, atmospheric disturbance elimination, electronic stabilization, local contrast enhancement, and noise reduction. The company offers several tools to support developers and integrators, including the Qualcomm RB5 development kit and comprehensive software and board-support packages. These resources assist developers in designing and producing custom interface boards tailored to specific product requirements regarding shape, functionality, and input-output specifications.

Dan Walker, the Vice President of Product Management at Teledyne FLIR, emphasized that the AVP processes AI workloads up to five times faster than its competitors, marking it as the most powerful and efficient processor in the current market. This high performance, combined with edge computing and Prism digital solutions, marks a significant advancement in electro-optical system capabilities, simplifying development and minimizing integration risks.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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