Researchers have developed a wafer-integrated approach that combines antennas and semiconductor switches, potentially reducing manufacturing complexity while enabling compact, high-density beam-steering systems for 6G networks.
A research team at Seoul National University has developed STARE, a wafer-integrated 6G beam-steering antenna technology that combines antennas and radio-frequency semiconductor switches on a single wafer. The approach could reduce manufacturing complexity and costs while supporting high-density antennas for future wireless communications.
The technology addresses limitations in conventional antenna systems, where antennas and RF semiconductor chips are typically manufactured separately before being assembled. As 6G mobile and satellite communications require more antennas and increasingly precise control of electromagnetic waves, these conventional processes can become costly and difficult to scale.
STARE integrates the semiconductor and electromagnetic functions during wafer fabrication. Researchers designed the RF switches and antennas together, allowing both components to be produced simultaneously. The approach is intended to simplify manufacturing while supporting the dense antenna arrangements required for advanced beam-steering applications.
The researchers also developed a fabrication process that enables metal structures on opposite sides of a wafer to be connected through wafer interconnections. This allows integrated semiconductor devices to communicate with antenna structures without requiring conventional assembly methods.
A key part of the work involved combining semiconductor fabrication with electromagnetic analysis. Rather than designing the antenna separately from the semiconductor devices, the researchers used measured characteristics from fabricated devices to refine the antenna design.
The resulting architecture is aimed at applications where many antennas must operate simultaneously. Potential uses include 6G mobile communications, satellite communications, reconfigurable intelligent surfaces and integrated sensing and communication systems.
The team said the approach could also support beam-steering systems for terrestrial and non-terrestrial networks, as well as communication control for robots and autonomous systems. Other possible applications include low-Earth-orbit satellite connectivity, wireless power transfer and high-speed wireless connections in AI data centres.
The research was published in Nature Communications. The researchers plan to work with foundries to scale the technology to larger wafers and develop it into a versatile platform for future wireless systems.
