HomePress ReleasesMOSFET Module That Supports Fast-Switching DC-Link Voltage

MOSFET Module That Supports Fast-Switching DC-Link Voltage

Also suitable for increasing the power rating and efficiency of solar systems, ensuring short and clean commutation loops

Infineon Technologies AG has launched a new EasyPACK 2B module in the company’s 1200 V family. The module comes in 3-level Active NPC (ANPC) topology and integrates CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices and an NTC temperature sensor along with PressFIT contact technology pins. The power module is suitable for fast-switching applications like energy storage systems (ESS). The module also increases the power rating and efficiency of solar systems and supports the growing demand for 1500 V DC-link solar applications.

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Using the latest CoolSiC MOSFET and TRENCHSTOP IGBT7 technology combined with an increased diode rating, the Easy module F3L11MR12W2M1_B74 is designed to operate over the entire power factor (cos φ) range. A single module per phase is capable of supplying a power level of up to 75 kW in energy storage applications. For solar applications, a power level of up to 150 kW can be reached by operating two modules in parallel per phase.

With its improved pin positioning, the module also ensures short and clean commutation loops with reduced stray module inductances. Its optimised layout enables excellent thermal conduction of the CoolSiC MOSFET chips within the EasyPACK 2B package. In addition, the power module supports easy design-in and provides a high degree of freedom for inverter design.

The EasyPACK CoolSiC MOSFET module F3L11MR12W2M1_B74 is now available.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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