2ⁿᵈ Generation RF Multi-Chip Modules For 5G Infrastructure

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Increased efficiency and frequency coverage supports deployment of more powerful 5G mMIMO radios with reduced electricity consumption

Supporting the evolution of 5G mMIMO active antenna system requirements for cellular base stations is the new 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs). This all-in-one power amplifier module family based on LDMOS technology accelerates 5G coverage and offers high output power, extensive frequency coverage and high efficiency.

The 2nd generation of Airfast MCMs comprises 1new devices covering 5G frequency bands from 2.3 to 4.0 GHz, from 37 to 39 dBm average output power. 

The RF power Multi-Chip Modules include LDMOS ICs, paired with an integrated Doherty splitter and combiner and a 50-ohm in/out matching. This high level of integration removes RF complexities, decreases qualification cycle time and reduces overall development time.

“Our aggressive drive for integration brings more features into each module, which means fewer components for our customers to source, assemble and test. The result is a higher power yet more cost-effective, compact design. This translates into faster time to market for our customers and mobile network operators who are tackling the need for 5G expansion,” said Paul Hart, Executive Vice President and General Manager of NXP’s Radio Power.

The Multi-Chip Modules are now available from NXP Semiconductors.


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