HomeTech ZoneComponents CornerNew Chip NTC Thermistors For Conductive Adhesion Mounting

New Chip NTC Thermistors For Conductive Adhesion Mounting

Capable of operating in high temperatures and AEC-Q200 qualified with proven reliability for automotive applications

Making conductive adhesion mounting a fairly simple procedure is the new NTC thermistor chip series called the NTCSP. The chip NTC thermistors are used for temperature sensing and compensation, measuring without direct contact in automotive applications including ABS, inside the transmission or engine and more. The new NTCSP series part numbers come in 10 kΩ, 47 kΩ, and 100 kΩ types.

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The new chip NTC thermistors product adopts AgPd (Silver palladium alloy) termination, which enables them to meet the needs for diversified mounting methods. 

Main applications

  • Temperature measurement and compensation in wide temperature ranges
  • Soldering connections that are difficult in the mounting process
  • Automotive applications (ABS, transmissions, engines, etc.)
  • Air conditioner IPMs (Power MOS-FET)

The NTCSP series has a wide operating temperature range, from -55℃ to 150℃. They are highly reliable and certified by AEC-Q200, the global automotive standard for passive components.

Available in dimensions of 1.0 × 0.5 mm and 1.6 × 0.8 mm, the product can be obtained from TDK.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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