HomeTech ZonePower Electronics Tech24 V Dual-Channel Low Side Driver With Integrated Thermal Pad

24 V Dual-Channel Low Side Driver With Integrated Thermal Pad

It enables source – sink drive capability having under-voltage lockout protection for applications with higher switching frequencies

For operations at high switching frequencies as well as high peak output currents, the EiceDRIVER 2ED24427N01F, a new 24 V dual-channel low side gate driver offers suitability for applications with higher switching frequencies such as power factor correction and synchronous rectification and transformer driver or a buffer driver for parallel MOSFET applications or high-current IGBT modules.

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The EiceDRIVER 2ED24427N01F provides a symmetrical output stage with 10 A source and sink drive capability with integrated under-voltage lockout (UVLO) protection and logic level enable control. With 55 ns propagation delays and 450 mΩ (max) source and sink ON resistance per channel, the driver enables high switching frequencies with reduced switching losses of the power transistors.

The integrated thermal pad offers very low thermal resistance to enable reliable operation at lower temperatures under high current conditions or high switching frequencies. 2ED24427N01F is rated for industrial temperature grade operation.

The EiceDRIVER 2ED24427N01F can be ordered now from Infineon Technologies AG in an industry-standard DSO-8 (SOIC-8) package with a thermal pad and 2 kV HBM ESD ratings.


Vinay Prabhakar Minj
Vinay Prabhakar Minj
Vinay Prabhakar Minj is a technology writer and science communication specialist with a Master’s degree in Communication of Science and Innovation (Science Communication). He is a prolific contributor to Electronics For You, where he has authored over 1,000 articles covering electronics, semiconductors, embedded systems, IoT, and emerging technologies. With a strong foundation in science communication, Vinay focuses on translating complex engineering concepts into clear, accessible, and application-oriented content. His work spans topics such as sensor technologies, chip design, wireless systems, and next-generation electronics, making advanced innovations easier to understand for engineers, students, and industry professionals. Through his extensive contributions, he has built a reputation for delivering reliable, well-researched, and practical insights that help readers stay updated with the rapidly evolving electronics ecosystem. His writing bridges the gap between technical depth and real-world usability, supporting both learning and decision-making in the field.

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